A novel in-situ 4-point-bend system for stress impact analysis

A novel in-situ 4-point bending system characterizes the influence of mechanical stress on e.g., microelectronic devices, thin film systems, novel materials, etc. On the strength of the low build height of the system, the setup with clamped samples can be used in-situ in several tools like Nanoindenters, SEMs or Raman systems. Due to the homogeneous bending moment between the inner support points, the sample region that can be studied under stress is relatively large.

Quelle: IDW Informationsdienst Wissenschaft